ELECTROPLATING ANALIZ
| Kouch kategori | Kouch Abreviyasyon | Koulè | Kouch epesè | Konparezon nan kapasite pwoteksyon sifas kouch la | Tanperati Aplikasyon Rekòmande | Tansyon andigman | ||
| Tès espre sèl net | Tès chalè imidite | Tès PCT | ||||||
| Ni/barik plating | Ni | Ajan klere | 10-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ≤260 | 36 |
| Ni/etajè plating | Ni | Ajan klere | 10-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ≤260 | 36 |
| 3 + Cr Zn/Ble-Blan Zn/barik PLATING | Zn | Ble & blan | 5-10 | ☆☆☆☆ | ☆☆☆ | ☆☆☆ | ≤160 | 38 |
| 3+Cr Zn/Ble-Blan Zn/Rack Plating | Zn | Ble & blan | 5-10 | ☆☆☆ | ☆☆☆ | ☆☆☆ | ||
| 3 + Cr Koulè Zn / barik plating | Koulè Zn | Koulè klere | 5-10 | ☆☆☆ | ☆☆☆ | ☆☆☆ | ||
| 3 + Cr Koulè Zn / Etajè Plating | Koulè Zn | Koulè klere | 5-10 | ☆☆☆ | ☆☆☆ | ☆☆☆ | ||
| Ni + chimik Ni barik plating | Ni + Chimik Ni | Ajan nwa | 12-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆ | ≤200 | 36 |
| Ni + Chimik Ni Rack Plating | Ni + Chimik Ni | Ajan nwa | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆ | ||
| Ni+Cr | Ni+Cr | Nwa nwa | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ≤260 | 36 |
| Tflon | Tflon | gri fonse |
| ☆☆☆ | ☆☆☆ | ☆☆☆ | ≤260 | 36 |
| Ni+Nwa Ni | Ni+Nwa Ni | nwa | 12-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ||
| Ni+Sn | Ni+Sn | Ajan klere | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | - | 36 |
| Ni+Ag | Ni+Ag | Ajan | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | - | 36 |
| Ni+Au | Ni+Au | Golden | 10-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | - | 36 |
| Epoksidik | EPOXY | nwa | 10-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆ | ≤160 | 36 |
| Ni/NiCu+Epoxy | NiCuNi/NiCu+EPOXY | nwa | 15-25 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆ | ≤160 | 36 |
| Pasivasyon/Fosfatizasyon | Fosfò/Pasivasyon | gri fonse | 1-3 | — | — | — | ≤240 | 37 |
| Nano kouch | Nano kouch | Limyè gri | 15-30 | ☆☆☆☆☆☆ | ☆☆☆☆☆☆ | ☆☆☆☆☆☆☆ | ≤300 | 33 |
REMAK
1. Anviwònman SST: 35±2 ℃, 5% NaCl, PH = 6.5-7.2, Sèl espre koule 1.5ml / Hr.
2. PCT Anviwònman: 120±3℃,2-2.4atm, dlo distile PH = 6.7-7.2, 100%RH
TANPRI KONTAKTE NOU POU NENPÒT DEMANN ESPESYAL